FUNCTIONAL FEATURES
Functional Features
Equipped with multi-core heterogeneous architecture, computing power allocation is flexible and efficiently supports AI algorithms and embedded control; storage can be flexibly expanded, balancing large capacity and high-speed read/write; rich interfaces are integrated, excellent hardware expandability, suitable for multi-device linkage; compatible with mainstream embedded systems and development environments, cost-effective, providing reliable hardware support for embedded custom development.
SPECIFICATIONS
Specifications
According to different parameters such as CPU model and operating temperature, please select the most suitable model from the following list. For bulk orders, 8 Miles Electronics provides customization services that can match core board parameters according to demand. The core boards undergo rigorous testing and support stable operation in industrial-grade wide-temperature environments.
Name Configuration
Core Board Model MD6X_DH_CORE_V10
Processor Manufacturer NXP
Main Control Chip MCIM6X4CVM08AC
CPU Multi-core Heterogeneous A9+M4
Size 70mmx60mm
Supported Systems FreeRTOS+Linux4.9.88
Application Field Industrial Control/Smart Charging Pile/Automotive Electronics/Digital Instrument
NPU None
Memory RAM 512MB LPDDR4
Emmc Storage 8GB High-Speed EMMC
Wireless Network 2.4G+5.8G Dual-band WiFi High-speed SDIO Interface
Wired Network Dual GMAC
LVDS/RGB/HDMI 720P@60Hz LVDS (4-channel)/24-bit RGB
MiPiTX None
MiPiRX None
PCI-E 1x PCIE 2.0
USB 3 independent USB 2.0 ports (one is OTG)
Operating Temperature Industrial grade -40 to 85 degrees
CAN/FD Dual CAN Bus
Gigabit Ethernet Dual RGMII Ethernet Interface
I2S/SPI 1 SPI channel
I2C/I3C 4 I2C channels
UART 5 UART ports
GPIO Up to 125 multiplexed GPIO
ADC 8 analog ADC input interfaces
Connector 1.27MM Pin Header with Frame